ET1893

ET1893
  • Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: Ag
  • Application: Capacitor - MLCC, chip
  • Description: ET1893 is a low temperature plateable Ag End Termination. ET1893 has excellent adhesion to a variety of ceramic compositions when fired at ≤ 600°C. ET1893 is supplied with a rheology suitable for automatic dipping machines.
  • Key features: Nickel plateable#Firing temperature less than 600 °C#Machine dippable
  • Process Temperature: 525-600 °C peak temperature. Dwell time of 1-2 minutes at peak.
  • Viscosity: 15-30 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Alloy Ratio: 100
  • Paste Function: Plateable

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