ET1897

ET1897
  • Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: Ag
  • Application: Capacitor - MLCC, chip
  • Description: ET1897 is a nickel plateable silver end termination designed to be compatible on Multilayer ceramic chip capacitors (NPO and X7R bodies). Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface. The rheology of ET1897 is suitable for machine dipping.
  • Key features: Nickel plateable no pre-plate processing#Low usage excellent coverage uniformity#Dense fired microstructure
  • Process Temperature: 700-800 °C peak temperature. Dwell time at temp. 5-7 minutes.
  • Viscosity: 30-40 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Alloy Ratio: 100
  • Paste Function: Plateable

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