ET2854

ET2854
  • Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: Ag
  • Application: Capacitor - MLCC, chip
  • Description: ET2854 is a nickel plateable silver end termination designed to be compatible on Multilayer ceramic chips, especially on alumina bodies. Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface.
  • Key features: Excellent adhesion property after plating#Excellent hermeticity
  • Process Temperature: Peak temp: 630-800 °C. Dwell time: 5-7 minutes.
  • Viscosity: 55-65 Kcps Brookfield HBDV-III Ultra SC4-14 spindle and 6R utility cup at 10 rpm, 25°C

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