IP2108

IP2108
  • Paste Type: Dielectric / Glaze
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: None
  • Application: Hybrid IC
  • Description: IP2108 is a transparent black firing, lead-free, screen printable, thixotropic overglaze paste for various purposes, especially for protecting thick film resistors or conductors. Because of the high firing temperature, it fires to a very dense glaze layer which is highly passivated to withstand abrasion and aggressive media occurring e.g. in plating processes.
  • Key features: High temperature glaze#Insulating layers for circuit protection vs moisture and moisture
  • Process Temperature: Fire at 850 °C (peak) for 10-12 minutes, and with a total firing cycle time of c. 30-60 minutes.
  • Viscosity: 20-40 Pas (25 °C, D = 100/s)
  • Solids: 75.0 ± 1.5 %

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