IP9246

IP9246
  • Paste Type: Dielectric / Glaze
  • Application Method: Screen Printing
  • Substrate: Aluminum Nitride
  • Metal: None
  • Application: Hybrid IC
  • Description: IP9246 is Pb, Cd, and Ni free high temperature dielectric that can be fired in nitrogen. It is compatible with a variety of thick print copper pastes. It has a low thermal expansion coefficient allowing for applications which utilize aluminum nitride.
  • Key features: Nitrogen fireable#Low thermal expansion coefficient (CTE)
  • Process Temperature: 925-950 °C peak temperature. Dwell time of 10 minutes.
  • Film Thickness : 15-20 um (1 layer); 40-U11975 um (3 layers)
  • Viscosity: 40-60 Kcps, Brookfield RVTSC4-14 spindle with 6R utility cup at 10 rpm, 25 °C
  • Solids: 74.0 ± 2.0 %
  • Rel. Dielectric Constant K: 6.0-9.0 at 1 KHz
  • Dissipation Factor: < 0.5 % at 1 KHz
  • Insulation Resistance: > 109 ohm at 100 V DC
  • Breakdown Voltage : > 1000 V DC per mil (3 individually fired layers)

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