• Paste Type: LTCC
  • Application Method: Stencil Printing
  • Substrate: LTCC
  • Metal: Ag
  • Application: LTCC
  • Description: TC7304A is a pure Ag via fill which provides excellent compatibility with Heraeus tape system of CT700 and CT800 during the co-firing process.
  • Key features: Optimized for stencil printing of vias#Compatible with other co-firing pastes and with various post firing pastes#After firing, the paste can easily be soldered
  • Process Temperature: Fire at 850-865 °C (peak) for up to 30 minutes, and with a total firing cycle time up to 10 hours (most often practicable in a box oven).
  • Viscosity: 200-300 Pas (25 °C, D = 15/s)
  • Conductivity: ≤ 0.02 (FFT: 60 um)

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