Electronic devices need to deliver an ever-increasing function in a smaller space with each new generation. Development targets are to reduce device weight, size, improve reliability and comply with new legal requirements.
Continuous and holistic optimization of materials, interfaces, processes and techniques is necessary to overcome technical limits to design – and it means working at the edge of the possible. If you push the limits only at specific interfaces, other challenges and bottlenecks will appear!
This requires a different approach compared to the past – more teamwork across the borders of disciplines, across the borders of materials and system integration, across the borders of customer and suppliers.
Electronic devices consist of many materials; substrates, connectors, active and passive components, solders, adhesives, bonding wires, insulation and molding compounds and housings. Each material on its own is easy to handle and to control. However, when coming together in one device it becomes complex.
The interface between materials is most difficult to manage, especially when materials from different suppliers are used. Resolving one issue with one supplier only leads to the next challenge with another material. This often leads to best compromises rather than real optimized solutions. It is more time consuming to manage stepwise compromises with many interfaces between companies than to enjoy a one-stop solution approach.
Perfectly matched materials systems from one preferred supplier are the answer to many technical challenges. Find out more about how it works.