IC Packaging Technology Expo

18th - 20th January 2017 - Tokyo, Japan

Anton Z. Miric, Vice President Product Management Materials Solutions spoke about:

Next Generation Material Packaging Solutions for High-reliability Die Attach and Bonding

Anton Miric speaks about Next Generation Material Packaging Solutions for High-reliability Die Attach and Bonding
Anton Z. Miric, Vice President Product Management Materials

New die attach and bonding solutions for packaging of power modules is needed to keep pace with

  • increased power densities,
  • higher operating temperatures and
  • switching frequencies.

The new generation of packaging materials can improve the electrical, thermal and reliability performance of the die attach and die top connection.

The focus of the presentation lies on sintering technology and die top system, which enables bonding with Cu-Wire.

Not able to attend the presentation - get the presentation here.

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