Heraeus @ PCIM Asia 2017

Heraeus Electronics, your expert for materials and materials solutions for the electronics industry, will showcase some of its newest innovations at PCIM Asia 2017. Matched materials help customers to develop solutions with higher power density and higher temperature. They also answer the demand for improved reliability and miniaturization.

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Steve Xie and Li-san Chan speak at PCIM Asia
Steve Xie and Li-san Chan

Study: Reliability Improvements in Die Attach Automotive Applications

June 27, 2017
14:20-14:40, within the exhibition hall
Speaker: Steve Xie - Technical Solutions Engineer

Product Manager: Li-san Chan

The automotive industry is increasing its silicon consumption. Electro-mechanical systems are close to heat source; hence high reliability die attach solder materials are required to operate in such harsh conditions. In this presentation, Heraeus will introduce a new high temperature die attach printing paste designed to improve reliability of automotive devices. This new solder paste has low voids performance and excellent stencil life. Material is already used in production at one of the major automotive device maker.

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