November 15th at 15:00 - 15:30
Hall A1 / 220 (SMT Speakers Corner)
Joerg Trodler, Technical Solution Manager at Heraeus Electronics
The development of new solder alloys for high temperature application has been increased during the last few years. For example, automotive applications use both Innolot® and/or HT1 alloys, especially when the devices have to work at temperatures up to 170°C.
For the solder alloy and the interconnection itself, there are some fatigue life advantages when using Innolot®, especially for thermal cycles -40/+150°C. On the other hand, by using Innolot there is a relatively high thermo-mechanical stress induced which can create ceramics defects at the passive components.
The presentation is about a comparison and discussion of the differences of the alloy based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses based on the finite element method.