Enabling Competitive Total Cost of Ownership - Heraeus presents Unique Packaging Solutions at Productronica 2017

Electronic markets are dynamic – a short time to market for new products becomes a crucial sales advantage, expectations on device features increase and competition on price gets tougher. Only those who succeed to optimize design and processes, shorten development cycles, bring costs down and reduce risks in all aspects can compete with the best.

As a solutions provider and innovation partner Heraeus has the capability to match all materials in a system perfectly to each other and to optimize all interfaces in order to achieve a maximum of system performance and reliability with lower costs and minimized risks.

Visit Heraeus at Productronica and find out more about our solutions for the electronics industry:

November 14-17, 2017
Messe München
Booth A4-442

Come and meet the experts during the exhibition, and find out how we can assist you in optimizing your process for better results.

Product Highlights at Productronica 2017

Visit our expert presentation: Risk for Ceramic Component Cracking Dependent on Solder Alloy and Thermo-mechanical Stress

November 15th at 15:00 - 15:30
Hall A1 / 220 (SMT Speakers Corner)
Joerg Trodler, Technical Solution Manager at Heraeus Electronics

The development of new solder alloys for high temperature application has been increased during the last few years. For example, automotive applications use both Innolot® and/or HT1 alloys, especially when the devices have to work at temperatures up to 170°C.

For the solder alloy and the interconnection itself, there are some fatigue life advantages when using Innolot®, especially for thermal cycles -40/+150°C. On the other hand, by using Innolot there is a relatively high thermo-mechanical stress induced which can create ceramics defects at the passive components.

The presentation is about a comparison and discussion of the differences of the alloy based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses based on the finite element method.

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