China Semiconductor Technology International Conference (CSTIC)

Visit Heraeus expert presentations at CSTIC 2017, which will be held

on March 12-13, 2017
at Shanghai International Convention Center, Venue: No.2727 Riverside Avenue Pudong, Shanghai 200120, China

in conjunction with SEMICON China 2017.

More about the event.


Visit our booth at PRODUCTRONICA China, located at Hall E2, booth No. 2478, to learn more about our products and innovations.

Exhibition Date: March 14-16, 2017
Venue: Shanghai New International Expo Centre, No. 2345 Longyang Road, Pudong New District, Shanghai, China

Advanced Packaging SiP Solder Materials Solutions

Dr. Larry Wang and  Li-san Chan speak about Advanced Packaging
Dr. Larry Wang and Li-san Chan


Speaker: Dr. Larry Wang, Heraeus Electronics
Authors: Li-san Chan, Dr. Rui Fen Zhang, Lenz Pan, Joseph Baquiran, Vincent Teo

Monday, March 13, 2017 Shanghai International Convention Center
Symposium VII, Session IV, 10:30-10:55

Learn more about benefits and compatibility between flip chip attach dipping paste and component attach solder materials for SiP applications to minimize defects:

  • Driven by market trends in personal mobile devices, wearables and internet of things, System-in-package technology is the preferred technique to integrate processing & memory devices, and passive components in a single module with a small form factor.
  • As the number of components in the package increases without compromising the package size, high package density is increasingly creating challenges for solder materials.
  • Solder splashing, solder balling causing shorts between copper pillars and incomplete forming of solder joints are common challenges faced.

Next Generation Coated Bonding Wires

Lois Liao speaks about Next Generation Coated Bonding Wires
Lois Liao


Speaker: Lois Liao, Heraeus Electronics

Monday, March 13, 2017 Shanghai International Convention Center
Symposium VII, Session VI, 17:25 - 17:40


Lois Liao speaks about coated bonding wires, including high reliability Pd/Cu, insulated Pd/Cu and Au/Ag wires. Bondability and reliability performance of coated bonding wires will be compared with conventional bonding wires:

  • Bonding wires have been evolved from gold (Au) to copper (Cu) and the recent silver (Ag) wires in the past decade. The conventional bonding wires were bare wires with either pure or doped/alloyed metals.
  • In recent years, coated bonding wires have been adopted due to their remarkable performance, such as palladium coated Cu wire (Pd/Cu) which has excellent 2nd bond performance and good mean time between assist (MTBA) compared to bare Cu wires. However, the reliability performance of Pd/Cu has yet met the automotive industry requirement and also need protection atmosphere to avoid Free Air Ball oxidation.
  • One of the latest coated wire is Au coated Ag wire (Au/Ag). Au/Ag has bonding characteristics similar to gold, such as wider 2nd bond window, improved floor life time, softer FAB etc. One of the outstanding features is that it can be bonded without protection atmosphere without compromise in reliability.
  • The insulated Pd/Cu wire is another newly developed coated wire. It is coated with a thin layer of organic material, providing electrical isolation from adjacent wires in the package and may enable crisscross connecting and die size reduction.
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