Heraeus at SMTAi

Enabling Maximized Reliability - Heraeus Electronics showcases Packaging Solutions at SMTAi 2017

For advanced packaging solutions and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. During SMTAi 2017 Heraeus Electronics, will showcase some of its latest innovations in Ag Sinter Pastes, Water Soluble Solder Pastes, and No Clean Solder pastes.

In addition to new product offerings, we will unveil our brand new U.S. based Surface Mount Techology Customer Applications Lab, which was built to aid our customers optimizing their processes for higher reliability.

Product Highlights at SMTAi

WS5112: The latest innovation in water-soluble solder pastes from Heraeus Electronics provides unparalleled benefits for your process.


WS5112 is a water soluble, halogen-free paste that prints like a no clean due to its excellent inherent rheological properties, offering superior fine pitch printing performance. The proven capabilities of this material do not end here. Stencil life for WS5112 is long lasting, the flux matrix can accommodate multiple alloys, and powder-types from type 5-7. WS5112 produces minimal; easily cleanable post-process residues, excellent wetting, and zero spatter. Visit us at booth 1009 during SMTAi for more information and a virtual tour of our brand new SMT Application Lab.


  • Zero Solder Spatter
  • Compatible With Heraeus Smartflux
  • Compatible with Multiple Alloys
  • Powder types from type 5 to type 7
  • Available in Low, and Ultra Low Alpha Count

Get more details here .

Booth Q&A session regarding the new SMT Customer Applications Lab

FSE Karl Pfluke sees big advantages for his customers in the new SMT application lab
Karl Pfluke

Stop by Heraeus booth at September 19, 2017, 2:30 PM and find out why we are excited about our new applications lab in the U.S.

Heraeus will unveil at SMTAi its brand new U.S. based cumsters applications lab. This laboratory is focused on assisting our customer base with application support and process development. Therefore we equipped it with state of the art equipments to provide valuable information.

Our FSE Karl Pfluke explains: "Having a lab in the U.S. gives us the opportunity to support & sustain assembly products and manufacturing processes at the customer level. Let us introduce you to the Lab operators as well as the state of the art equipment we have put in place for our customers."

Visit our expert presentations: R1 – a German Reliability Comparison Study between 14 Lead free Alloys

Jörg Trodler speaks at SMTAI 2017
Jörg Trodler

Monday, September 18th at 9:30 am
Joerg Trodler, Product Manager at Heraeus Electronics

The reliability of a solder joint is an important part of the reliability of electronic products (including SMT-Assemblies). Every customer demands a long individual lifetime of the used equipment. Industry experience with SnPb alloys over a long duration has led to a broad expertise regarding reliability, providing a comprehensive reliability data pool.

Similar reliability results exist only for selected lead free alloys. The main goal of project R1, is the comparison of commonly used solder alloys with several new solder alloys available on the market. Project R1 is a joint effort of the “Working Group Lead Free” in Germany.

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