Heraeus at EPTC 2018

Electronics Packaging Technology Conference 2018 in Singapore

Visit Heraeus at EPTC 2018 and find out more about our materials and material solutions.

6th December 2018
Singapore

Come and meet our experts during the exhibition, and find out how we can assist you in optimizing your process for better results.

Join our experts presentations at EPTC 2018

High bonding strength of silver sintered joints on non-precious metal surfaces by pressure sintering under air atmosphere using mico-silver sinter paste

Authors: Dr. Ly May Chew, Wolfgang Schmitt
Venue: Leo 2
Date: 6 Dec 2018
Time: 11:20 – 11:40
Oral Presentation

The study of void formation in Ag sinter joint

Authors: Dr. Ruifen Zhang, Lingling Teo, Dennis Ang
Venue: Leo 2
Date: 6 Dec 2018
Time: 15:20 – 15:40
Oral Presentation

Coated Silver Wire Bond: Reliability of Epoxy Molded Device

Authors: Dr. Murali Sarangapani, Senthilkumar Balasubramanian, Eric Tan Swee Seng, Dr. Jason Wong Chin Yeung
Venue: Pisces
Date: 6 Dec 2018
Time: 10:00 – 11:00 & 15:40 – 16:40
Poster Presentation

Fine pitch solder paste for advance packaging application

Authors: Dr. Ruifen Zhang
Venue: Pisces
Date: 7 Dec 2018
Time: 10:20 – 11:10 & 15:20 – 15:40
Poster Presentation

Characterization and performance of ultrafine Lead-Free powders

Authors: Wei Chih Pan, Leng Hin Tan, Yee Ting Lo, Li San Chan, Dr. Sebastian Fritzsche
Venue: Pisces
Date: 7 Dec 2018
Time: 10:20 – 11:10 & 15:20 – 15:40
Poster Presentation

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