Electronica 2018

Highest reliability starts in detail with perfectly matched electronic materials

Visit Heraeus at Electronica 2018 and find out more about our material solutions for Automotive Electronics.

November 13-16, 2018
Messe Munich
Hall: B4, Booth Number: W19

Come and meet our experts during the exhibition, and find how our combined expertise can optimize your processes and results.

Heraeus Presents Materials Solutions for Automotive Applications

The future of the car

Heraeus Electronics develops and manufactures important materials solutions for the assembly and packaging technology of electronic devices: aluminum bonding wires and ribbons, roll clad strips and stamped parts, metal ceramic substrates, solder paste, sinter paste and thick film paste. When these materials are combined in a single device, complexity increases. The performance and reliability of the devices does not only depend on the performance of each individual material, but also on the interplay of the materials in the end application. This also results in the need for higher integration.

With our broad portfolio and decades of experience in supplying materials to the automotive industry, we dissolve these issues by creating perfectly matched solutions that minimize complexity and compromises. Heraeus Electronics is your partner of choice answering your technical challenges by offering innovative materials, matched materials as well as pre-applied and qualified material systems. Combined with our application knowledge and simulation competence we help you to shorten your development cycles, lower your costs and bring next generation products faster to market.

Join our expert presentation at Electronica 2018

Get the most out of your power module with Heraeus Die Top System (DTS®)

Wednesday, November 14th at 13:30
Speaker: Dr. Christophe Fery

Due to continuous rise in power density, coupled with higher operating temperatures and demand for improved reliability, die attach & interconnection using solder and Al wire are facing their limits.

In comparison, by combining copper wire with sinter technology, the Heraeus DTS® enables an increase of > x50 of the power cycling capability. This enables a reduction of power derating or a reduction of the chip size, thus opening the road for junction temperatures of more than 200 °C.

DTS® relies on wire bonding, which is the most common and proven interconnection technology. With pre-applied sinter paste and fixation material, the industrialization is significantly simplified. With the same equipment, all layout variances are covered from pilot to serial production. And with the support of Heraeus Engineering Services, the time to market is reduced.

The Total Cost of Ownership is therefore minimized, when compared to other advanced die connections.

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