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IMAPS UK - Die Attach Workshop

Visit Heraeus at the Die Attach Workshop and find out more about technologies, materials and processes related to attaching bare semiconductor devices onto and into the various substrates and assemblies.

November 22, 2018
The Manufacturing Technology Centre (MTC)
Ansty Park - Coventry

Join our expert presentation

New Material Developments in Sintering

Thursday, November 22th at 14:00
Speaker: Dr. Ly May Chew

Dr. Ly May Chew


Silver sintering has drawn considerable attention as interconnect material for die attach application owing to its superb properties such as high melting temperature, high thermal and electrical conductivity. Our previous studies have demonstrated the feasibility of die attachment on precious metal surfaces using silver sinter materials. Die attachment on non-precious metal surfaces by silver sintering has a huge potential in reducing the manufacturing cost. However, the biggest obstacle of silver sintering on non-precious metal surfaces is the oxide layer formed on the surfaces. The oxide layer prevents strong bonding between silver and non-precious metal surfaces. Recently, we have developed a silver sinter paste for die attachment on non-precious metal surfaces.

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