Heraeus at IPC APEX

Heraeus presents Unique Electronic Packaging Materials for Changing Markets at IPC APEX 2018

The electronics market evolves at a fast pace, competition gets keener – a short time to market for new products becomes a crucial sales advantage and expectations on device features increase. Heraeus offers a wide range of unique materials and materials solutions for electronics packaging industry to stay ahead of the game.

Meet our experts during IPC APEX and learn more about our highly efficient materials and solutions for the electronics market.

Visit Heraeus at IPC APEX 2018 and find out more about our unique materials

February 27 - March 1, 2018
SAN DIEGO, California
Booth 1713

Come and meet our experts during the exhibition, and find out how we can assist you in optimizing your process for better results.

Product Highlights at IPC APEX

Visit our expert presentations: Advanced non pressure silver sinter process by infrared

Daniel Schnee speaks at IPC APEX 2018
Daniel Schnee

Thursday, March 1, 2018 - 9:00 am to 10:00 am
Technical Conference Sessions, Location 2
Daniel Schnee, Head of Paste Development at Heraeus Electronics

Typical non-pressure sintering profile carried out in a convection oven takes approximately 4 hours long to complete, which if shorten, increases attractiveness to adopt non-pressure sintering.

In this study, the objective was to investigate using IR radiation to reduce the total sintering process time. From our investigations using IR radiation, comparable non-pressure sintered results were achieved with 25% of the standard convection oven profile. In convection oven, non-pressure sintering is achievable up to typically 25 mm² die dimension.
Above this die dimension, risk of sinter defects increases. With IR radiation, cross section of die sizes above 25 mm² did not detect channeling nor voids. From the IR temperature profiling analysis, the uniform heat distribution within the specimen was a critical improvement, which encourages homogeneous densification of the sintered layer.
Furthermore we observed increases in die shear strength and higher thermal conductivity.

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