Heraeus at Semicon Taiwan

Heraeus at Semicon Taiwan 2018 - Heraeus Presents Advanced Materials for your Packaging Solutions

For advanced packaging and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency.

September 5-7, 2018
Taipei Nangang Exhibition Center
K2968 (1st Floor)

Come and meet our experts during the exhibition, and find out how our combined expertise can optimize your processes and results.

System in package

Heraeus Electronics to Showcase Matched Materials for System in Package

Join us at the show to find out how our matched materials for SiP enable you to develop and deliver better solutions in shorter time.

Expert Presentations

Join us at our booth #K2968 (Level 1), to hear our experts’ presentations. Get to speak with our product and technical experts and learn how about our new innovations can help you be competitive and succeed.

Expert Presentations at Semicon Taiwan
  • Bonding Wires for Semiconductor Applications
    Speaker: Mr. Eric Tan, Product Director
  • Ultra-Fine Pitch Advanced Materials for SiP applications
    Speaker: Ms. Li-San Chan, Global Product Manager
  • High Reliability Automotive Die Attach Paste
    Speaker: Mr. Dennis Ang, Global Product Manager

PLUS! Win a prize during our Q&A session and Special Lucky Draw

Download the full program schedule and find out how to participate in our lucky draw!

Product Highlights at Semicon Taiwan

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