For advanced packaging and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency.
September 5-7, 2018
Taipei Nangang Exhibition Center
K2968 (1st Floor)
Come and meet our experts during the exhibition, and find out how our combined expertise can optimize your processes and results.