Heraeus at Semicon Taiwan

Heraeus at Semicon Taiwan 2018

Heraeus Presented Advanced Materials for your Packaging Solutions at Semicon Taiwan 2018
Download our experts presentations here.

For advanced packaging and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency.

Expert Presentations

You didn't have time to attend our presentations? Or would you like to read our presentations again? Then download them here.

Bonding Wires for Semiconductor Applications
Speaker: Mr. Eric Tan, Product Director

Ultra-Fine Pitch Advanced Materials for SiP applications
Speaker: Ms. Li-San Chan, Global Product Manager

High Reliability Automotive Die Attach Paste
Speaker: Mr. Dennis Ang, Global Product Manager

Product Highlights at Semicon Taiwan

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