Heraeus Electronics will be making its return to Semicon West and presents the full range of assembly materials.
Heraeus Presents new Solutions for Advanced Packaging
With this return Heraeus will be bringing its solutions for Advanced packaging as well as the all new WS5112 type 7 ultra fine pitch solder paste powered by Welco® technology and a unique flux platform.
With Heraeus Advanced packaging solutions miniaturization of interconnections in complex devices can be realized.
Come and meet our experts during the exhibition, and find out how our combined expertise can optimize your processes and results.
Highlights at our booth
Tuesday, July 10, 2018 and Wednesday, July 11, 2018
From 2:00 - 5:00pm there will be a happy hour celebrating the release of our new type 7 Ultra fine pitch Solder paste.
All are welcome to attend and meet with our experts. Special prize Drawing will take place at 4:30 pm.
Product Highlights at Semicon West
Water Soluable Smart Flux
This combination of high tacky fluxes and special solder powders significantly improces yields for high value packages and devices utilizing copper or tin metallizations.