Enabling Miniaturization with Maximum Yield - Heraeus Electronics Showcases Advanced Packaging Solutions at Semicon West

For advanced packaging solutions and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. Heraeus innovative products, solutions and services enable customers to develop solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability and miniaturization.

Visit the Heraeus Electronics booth (#2005) at Semicon West to speak with our technical experts and learn how our matched materials and other innovations can help you be competitive and succeed.

Heraeus Electronics will be making its return to Semicon West and presents the full range of assembly materials.

July 10-12, 2018
Moscone Center, San Francisco, CA
Booth Number: 2005

Heraeus Presents new Solutions for Advanced Packaging

With this return Heraeus will be bringing its solutions for Advanced packaging as well as the all new WS5112 type 7 ultra fine pitch solder paste powered by Welco® technology and a unique flux platform.

With Heraeus Advanced packaging solutions miniaturization of interconnections in complex devices can be realized.

Come and meet our experts during the exhibition, and find out how our combined expertise can optimize your processes and results.

Highlights at our booth

Tuesday, July 10, 2018 and Wednesday, July 11, 2018

From 2:00 - 5:00pm there will be a happy hour celebrating the release of our new type 7 Ultra fine pitch Solder paste.
All are welcome to attend and meet with our experts. Special prize Drawing will take place at 4:30 pm.

Product Highlights at Semicon West

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