IPC APEX 2019

PCIM Europe

The power electronics assembly market evolves at a fast pace, competition gets keener. Heraeus enables its customers to reach key targets for the development of their innovations by optimizing materials and materials combinations.

Meet our experts on PCIM Europe, which takes place on May 7th - 9th, 2019 at Messe Nuremberg in Nuremberg, Germany. Heraeus booth is a must-see. Visit us at Booth #9-533 to speak with our technical experts and learn more about our highly efficient materials and solutions for the electronics market.

Product Highlights at PCIM Europe for Power Electronic Applications

Condura®: Heraeus Electronics presents high reliable ground conditions for your specific requirements

 Heraeus Electronics presents its comprehensive portfolio of Condura® at PCIM Europe
  • Condura®.classic (DCB-Al2O3)
    Time-tested standard for power electronic applications
  • Condura®.extra (DCB-ZTA)
    Alumina DCB for more robustness to improve module reliability and processability
  • Condura®.prime (AMB-Si3N4)
    Highest mechanical robustness and outstanding thermal conductivity
  • Condura®+
    Choose your Plus out of 20 options to maximize your success in power electronics module production

DTS®: Get the most out of your power module with Heraeus Die Top System (DTS®)

Heraeus presents DTS on PCIM Europe
Layout by courtesy of Fraunhofer IISB

You are interested to boost lifetime and power density in your power modules? Free yourself from the technical limitations of today’s standard and discover Heraeus Die Top System (DTS® ).

DTS® significantly improves the electrical, thermal and reliability performance of the die connection thus improving the whole module performance.

Sinterable Temperature Sensors for Power Electronics

Sinterable Temperature Sensor

High-precise temperature measurement is essential for many key technologies, and a prerequisite for effective technical solutions. Power electronics modules are responsible for the energy management in electric vehicles. Heraeus offers specially developed sinterable temperature sensors, which optimally use the performance of the total system.

Join our expert presentation at PCIM Europe

Failure Mechanisms of Sintered Die Top Systems under Power Cycling Tests

Andreas Hinrich speaks about Sintered Die Top Systems at PCIM Europe

Thursday, May 9th at 14:00
Speaker: Andreas Hinrich

In previous studies, power cycling tests were performed for baseplate-free samples bonded with thick Cu wires with the assist of the Die Top System (DTS®, Heraeus Electronics). A significant reliability improvement of at least 55 times compared to soldered samples bonded with Al wires at the test conditions of ΔTj=130 K and ton=1 s was observed. However, the lifetime of the baseplate-free sample was strongly influenced by DCB fatigue.

In this work, the DCB with die & DTS® is soldered on the Cu baseplate. Thereupon, the number of cycles to end of lifetime reduced. The influence of the copper baseplate on the degradation of the DTS® is simulated with finite element method (FEM). The fatigues of the aluminum metallization and the Ag-sintered layer on the chip top-side were confirmed as the main failure mechanisms.


Interested in talking with our experts? Choose a schedule below to meet us at PCIM Europe.

Trade show dates:

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