Thursday, May 9th at 14:00
Speaker: Andreas Hinrich
In previous studies, power cycling tests were performed for baseplate-free samples bonded with thick Cu wires with the assist of the Die Top System (DTS®, Heraeus Electronics). A significant reliability improvement of at least 55 times compared to soldered samples bonded with Al wires at the test conditions of ΔTj=130 K and ton=1 s was observed. However, the lifetime of the baseplate-free sample was strongly influenced by DCB fatigue.
In this work, the DCB with die & DTS® is soldered on the Cu baseplate. Thereupon, the number of cycles to end of lifetime reduced. The influence of the copper baseplate on the degradation of the DTS® is simulated with finite element method (FEM). The fatigues of the aluminum metallization and the Ag-sintered layer on the chip top-side were confirmed as the main failure mechanisms.