IPC APEX 2019

SMTconnect

For advanced solutions and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus. Heraeus innovative products, solutions and services enable customers to stay ahead in the market.

Meet our experts at SMTconnect, which takes place on May 7th - 9th, 2019 in Nuremberg, Germany. Heraeus booth is a must-see. Visit us at Booth #4-240 to speak with our technical experts and learn more about our highly efficient materials and solutions for the electronics market.

Heraeus presents Microbond™ SMT650 Solder Paste at SMTconnect

Microbond™ SMT650 Solder Paste - Maximized Reliability Under Harsh Conditions

Microbond Solder Paste from Heraeus


Learn more about Heraeus Microbond™ SMT650 high reliability solder paste. Microbond™ SMT650 achieves a consistently high surface insulation resistance that prevents electrochemical migration. Combining the new F650 flux system with the Innolot alloy delivers superior reliability—particularly in miniaturized systems in the automotive industry.

Microbond Solder Paste from Heraeus


Key benefits of Microbond™ SMT650:

  • No dendrite and migration is observed for various SIR test after 1500 h
  • Excellent thermal mechanical strength, in combination with Innolot alloy
  • Clear residue for AOI and ICT
  • Excellent printing
  • Efficient wetting
  • Available in Type 4 with SAC305 and Innolot alloy


Interested in talking with our experts? Choose a schedule below to meet us at SMTconnect.

Trade show dates:

Your personal data will be used solely for processing and responding to this request. For this reason, your data may, if necessary, be passed on to other companies in the Heraeus group. Moreover, the data will not be published, passed on to third parties, or used for any other purpose. Details on our data handling policy can be found in our privacy statement.

*

A field marked with an asterisk is a required field

to top