Bonding is Forever – Next Generation Power Wires & Ribbons

PCIM Europe digital days - Virtual Round Table Meeting, July 8th, 2020

A limiting factor of power electronics in the high temperature range is aluminum wire. Compared to aluminum, copper has a better thermal and electrical conductivity and a lower coefficient of electrical expansion. However, bonding copper on a semiconductor is not always possible since a standard semiconductor surface is usually not designed for the hardness of copper.

How can the advantages of aluminum and copper be combined? And, besides bonding, what are other die top connection technologies available in the market today? Which one fits best to your requirements?

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