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New developments of direct bonding on non-precious metal surfaces by pressure silver sintering

Speaker: Ly May Chew
at: IMAPS-UK ­ Die Attach Workshop - 22. November 2018

Silver sintering has drawn considerable attention as interconnect material for die attach application owing to its superb properties such as high melting temperature, high thermal and electrical conductivity. Our previous studies have demonstrated the feasibility of die attachment on precious metal surfaces using silver sinter materials.

Die attachment on non-precious metal surfaces by silver sintering has a huge potential in reducing the manufacturing cost. However, the biggest obstacle of silver sintering on non-precious metal surfaces is the oxide layer formed on the surfaces. The oxide layer prevents strong bonding between silver and non-precious metal surfaces. Recently, we have developed a silver sinter paste for die attachment on non-precious metal surfaces.

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