Die Top System (DTS®) – A competitive extension of mAgic® sintering
PCIM webinar on May 4th, 2021 - Andreas Hinrich, Team Lead Technology and Dr. Christophe Féry, Product Manager Material Systems
Power solutions for eMobility require miniaturization, energy efficiency and higher reliability. To cope with the increasing power density and operating temperature, more reliable die interconnection is required. Heraeus mAgic® sinter technology offers solutions for contacting both back- and frontside of the die. For the die top contacting, to keep benefiting from the flexibility of wedge bonding, which is the dominant interconnection technology in the electronic industry, Heraeus developed the Die Top System (DTS®) to enable the bonding of copper wires or ribbons.