Solder Paste for SiP Printing of the Future

ELECTRONIC DEVICES such as smartphones, tablets or high-end laptops must perform greater tasks and should be as portable and compact as possible.

To enable more functions in a smaller space, System in Package (SiP) technology combines multiple semiconductor chips and many passive components together into a tiny module. This is a challenge for production, as complex and numerous steps are necessary to complete the assembly of such SiPs.

The result: Longer production times, lower capacities and higher costs. With Welco AP5112 Type 7, Heraeus Electronics offers a unique solder paste where passive components and flip-chips with copper-pillars can be assembled simultaneously – while lowering solder defects; and increasing efficiency and quality in production.

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