Heraeus’ newly developed SOL6700B dual printing busbar paste helps to realize higher efficiency and lower manufacturing costs of solar cells. SOL6700B contains a specific glass chemistry, imparting controlled reaction between Ag paste and the dielectric layer. At the same time, because of separate printing of busbar and finger paste, it does not need to consider the height of the busbar area, and allow to do more optimization on screen, to reduce the usage of the silver paste. The SOL6700B is designed to maximize the protection of the dielectric layer of cells from damage during metallization thus contributing to reduce electron recombination and improving the open-circuit voltage. Especially matching with mainstream finger paste on the market at present, can further improve the efficiency when combined with UFL screen printing technology. SOL6700B series, moreover, can be compatible with a variety of mainstream cell technology at present, including Mono/ Multi PERC, Double Passivation, Double Passivation+SE, N-type, MCCE and so on.
- Design for Dual Printing with low laydown
- Less reactivity into the passivation SiNx and AlOx/SiNx
- Excellent adhesion and wide soldering window
- Reduce the manufacturing cost of silicon solar cells
- Compatible with all kinds of mainstream cell technology
- No Cd and Pb