Silver pastes for Multi P- Type Cell

Driven by reduction of wafer processing cost, and efficiency improvement, the Diamond-Wire-Cut wafer has drawn a lot of attention from the PV industry since 2016. Due to its specially textured wafer surface (by RIE, Additive or MCCE process), the DWC wafer has special challenges for the front-side paste, such as adhesion or printability.

SOL9661D Series

Front-side Silver Paste designed for DWC mc Cell

The Heraeus SOL9661D series front-side silver paste was specially designed for the Diamond-Wire-Cut (DWC) multi crystalline solar cells with specially textured surface. In addition to great cost reduction, SOL9661D can raise the conversion efficiency of DWC cells by > 0.05%.

The new glass chemistry was developed to provide excellent adhesion of SOL9661D, which allows customers to optimize their busbar design for better electrical performance and cost reduction, especially on DWC/ Black-silicon texturing. Meanwhile, the new organic vehicle system is developed to provide superior ultra-fine-line screen printing, which allows customers to further narrow finger width for better electrical performance and cost reduction. It is worth mentioning that the SOL9661D platform allows our R&D to offer solutions for different printing technology, especially for Knotless screen printing.

KEY BENEFITS

  • Ultra-Fine-Line printing can boost additional efficiency gain on DWC wafer
  • New glass can provide great adhesion on DWC/ Black-silicon cells
  • Balanced metallization in both contact and Voc to achieve great efficiency gain
  • Compatible for Single printing, Dual and Double printing
  • Allow quick and efficient customization

SOL9651D Series

Front-side silver paste designed for Diamond-Wire-Cut mc cell can raise the conversion efficiency by > 0.1%.

The Heraeus SOL9651D series front-side silver paste was specially designed for the emerging Diamond-Wire-Cut (DWC) multicrystaline solar cells with specially textured surface.

In order to optimize your busbar design for better electrical performance and cost reduction, a new glass chemistry was developed. It provides excellent adhesion, especially on DWC/Black-silicon texturing.

Your Benefit - Our strength

  • Superior value with better electrical performance and high busbar adhesion.
  • Compatible for both multi and mono crystalline wafers.
  • Reducing the negative impact of irradiation on the charge carrier lifetime by an outstanding Light Induced Degradation.

SOL6700B Series

New Generation Dual Printing Busbar Paste

Heraeus’ newly developed SOL6700 dual printing busbar paste helps to realize higher efficiency and lower manufacturing costs of solar cells. SOL6700 contains a specific glass chemistry, imparting controlled reaction between Ag paste and the dielectric layer. At the same time, because of separate printing of busbar and finger paste, it does not need to consider the height of the busbar area, and allow to do more optimization on screen, to reduce the usage of the silver paste. The SOL6700 is designed to maximize the protection of the dielectric layer of cells from damage during metallization thus contributing to reduce electron recombination and improving the open-circuit voltage. Especially matching with mainstream finger paste on the market at present, can further improve the efficiency when combined with UFL screen printing technology. SOL6700 series, moreover, can be compatible with a variety of mainstream cell technology at present, including Mono/ Multi PERC, Double Passivation, Double Passivation+SE, N-type, MCCE and so on.

KEY BENEFITS

  • Design for Dual Printing with low laydown
  • Less reactivity into the passivation SiNx and AlOx/SiNx
  • Excellent adhesion and wide soldering window
  • Reduce the manufacturing cost of silicon solar cells
  • Compatible with all kinds of mainstream cell technology
  • No Cd and Pb

SOL6600B Series

New Generation Dual Printing Busbar Paste

Heraeus’ newly developed SOL6600B dual printing busbar paste helps to realize its higher efficiency and lower manufacturing costs of solar cells. SOL6600B contains a specific glass chemistry, imparting controlled reaction between Ag paste and the dielectric layer. At the same time, on account of separate printing of busbar and finger paste, it does not need to consider the height of the busbar area, and allow to do more optimization on screen, to reduce the usage of the silver paste.

The SOL6600B is designed to maximize the protection of the dielectric layer of cells from damage during metallization thus contributing to reduce electron recombination and improving the open-circuit voltage. Especially matching with mainstream finger paste on

the market at present, can further improve the efficiency when combined with knot-less screen-printing technology. SOL6600B series, moreover, can be compatible with a variety of mainstream cell technology at present, including MCCE, DWC, mono PERC, and so on.

KEY BENEFITS

  • Higher efficiency
  • Less reactivity into the passivation SiNx and Al2O3/SiOx
  • Excellent adhesion and wide soldering window
  • Reduce the manufacturing cost of silicon solar cells
  • Compatible with all kinds of mainstream cell technology
  • No Cd and Pb*

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