Application Engineering Services - optimize individual PV metallization processes

The customer´s metallization needs are very individual due to different solar cell production processes and technologies. Heraeus focuses on providing the optimal solutions by offering technical services for metallization pastes. It is our overall aim to support our customers to maximize the value of cells. We help as partner to increase cell efficiency at a lower cost-per-Wp.

Heraeus customers profit from a global located application engineering network in order to optimize photovoltaic production processes and yields. This includes making recommendations regarding cell design and layout, paste selection, as well as printing and firing optimization.

In order to be close to the customer, our experts travel to our customers’ sites to analyze the production process and to define production process steps that can be optimized to lower cost and to increase efficiency.

Alternatively, our experts work in the in-house Heraeus labs to help develop individual solutions. Heraeus technical service centers are located in all key markets: China (Shanghai), Taiwan (Taoyuan), Japan (Tokyo), Singapore, Germany (Hanau), United States (West Conshohocken).

The following processes and measurements can be performed in our technical service centers:

  • Solar I/V- characterization (FF, Eff., Rs, Rsh, etc.)
  • Dark IV- characterization (Ps-Eff., Jo1, Jo2, ideality factor, etc.)
  • Other advanced characterization available
  • Sheet resistance
  • Line resistance
  • Contact resistance
  • Aspect Ratio
Printing of Silverpaste
  • All current deposition techniques (Single Print, Dual Print, Double Print, Dispensing etc.)
  • Various screen and stencil types (Hybrid, V-mesh, stainless steel etc.)
  • A variety of printing layouts (various finger count and line widths)
  • Different squeegee types (Triflex, Carbon, Diamond etc.)
Firing of Photovoltaic Silver Paste
  • Great expertise and experience in firing optimization
  • State-of-the-art firing equipment from nameable suppliers
  • Different firing profiles (such as high/low BOP, SPIKE)
Soldering and adhesion testing
  • Soldering equipment suitable to replicate customer processes
  • Different soldering heads available (6-Pin, 12-Pin)
  • A variety of soldering ribbons (Pb free, Pb containing etc.)
  • Various soldering fluxes (Halide free, Halide containing)
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