Creating a vacuum tight seal on your process chamber is a vital process parameter. Heraeus OM100 is by far the best choice due to its unique properties that allow for an optimized surface finish.
Semiconductor batch furnaces require excellent sealing to prevent egress of process gases into the atmosphere and ingress of atmosphere into the process chamber. A tight sealing surface is therefore critical for both safety and for optimizing the process performance.
With OM100 you can achieve a perfectly sealing surface over the full lifetime of the process chamber including multiple cleaning cycles. Heraeus OM100 is capable of yielding the best surface condition in available heat isolation materials. Unlike other materials typically used in thermal isolation applications the surface of OM100 remains pristine after multiple etch cycles. This allows continued use over longer periods when compared to alternative competitor solutions which have shortened usable lifetime due to surface erosion and the increasing risk of leaking vacuum seals.