With the trend toward heterogenous integration, miniaturization and 5G, higher operating frequencies and higher semiconductor packaging density has led to the need for enhanced EMI shielding, both within the device and also against the electromagnetic noise from outside the device.
Therefore, compartment shielding at packaging level is required and classical shielding via metal housings is no longer possible at such a small scale.
Heraeus has developed a full system solution that optimizes EMI shielding while ensuring proper functioning of high-frequency onboard chips and their ultra-fast data transmission. This system consists of Heraeus special particle-free silver ink and a manufacturing process that uses inkjet printing to apply the shielding coating.
Heraeus as a full solution provider has the capability to match all process, product and equipment perfectly to each other. In our application center, we test our adaptions directly and optimize all interfaces between the materials in order to achieve a maximum of system performance and reliability.