Technical challenges in the electronic markets

The goal is clear - More function in smaller spaces. But what sounds simple is a continuous challenge to technology and its limits. What is important to overcome these barriers?

Technical challenges

Electronic devices need to deliver an ever-increasing function in a smaller space with each new generation. Development targets are to reduce device weight, size, improve reliability and comply with new legal requirements.

Continuous and holistic optimization of materials, interfaces, processes and techniques is necessary to overcome technical limits to design – and it means working at the edge of the possible. If you push the limits only at specific interfaces, other challenges and bottlenecks will appear!

This requires a different approach compared to the past – more teamwork across the borders of disciplines, across the borders of materials and system integration, across the borders of customer and suppliers.

Electronic devices consist of many materials; substrates, connectors, active and passive components, solders, adhesives, bonding wires, insulation and molding compounds and housings. Each material on its own is easy to handle and to control. However, when coming together in one device it becomes complex.

The interface between materials is most difficult to manage, especially when materials from different suppliers are used. Resolving one issue with one supplier only leads to the next challenge with another material. This often leads to best compromises rather than real optimized solutions. It is more time consuming to manage stepwise compromises with many interfaces between companies than to enjoy a one-stop solution approach.

Perfectly matched materials systems from one preferred supplier are the answer to many technical challenges. Find out more about how it works.

Thermal Management

Thermal Management

More electronic function in smaller spaces results in higher power density. The heat caused by power losses needs to be dissipated. The efficient management of thermal energy is a continuous companion of electronics development, otherwise the service lifetime of a device is severely limited or the chip itself is immediately damaged.

The thermal conductivity of single materials are well known and documented, but thermal resistance at interfaces between the materials needs to be measured in the application. If the materials come from different suppliers, this adds difficulties as to who is responsible for the whole system performance, both initially and in service.

This is where matched materials systems from one supplier offer unique advantages. Firstly, the development team can work with the specification data of the whole system. Furthermore, this system is better performing since the supplier has optimized both the single materials and the materials system. Therefore the customer can concentrate on other development tasks with confidence.