SMD-FC 0805 はハイブリット回路です. 高精度, 長期安定性が必要とされる量産向け低コストアプリケーションに最適です. 表面両端の接触面にメタライゼーション層があり, エッジ部分にはありません. はんだ付けの代わりに接着も可能としたフェイスダウン実装になっています. 従来のリフローはんだやウェーブはんだ付けに代わる導電性接着剤を使用することで, 信頼性と費用対効果の高い接合技術を可能にします. センサの基板材料 (セラミック) は, ハイブリット回路の熱膨張と同等です.
特にエネルギー管理, 医療および産業機器に応用されています. こちらの製品は自動車用にもご使用いただけます. この場合, お客様からの追加のご要望に対応できるか事前に確認させていただきます (例: IMDS, PPAPなど).
The information provided in this data sheet describes certain technical characteristics of the product, but shall not be qualified or construed as quality guarantee (Beschaffenheitsgarantie) in the meaning of sections 443 and 444 German Civil Code. The information provided in this data sheet regarding measurement values (including, but not limited to, response time, long-term stability, vibration and shock resistance, insulation resistance and self-heating) are average values that have been obtained under laboratory conditions in tests of large numbers of the product. Product results or measurements achieved by customer or any other person in any production, test, or other environment may vary depending on the specific conditions of use. The customer is solely responsible to determine whether the product is suited for the customer's intended use; in this respect YAGEO Nexensos cannot assume any liability. The sale of any products by YAGEO Nexensos is exclusively subject to the General Terms of Sale and Delivery of YAGEO Nexensos in their current version at the time of purchase, which is available under www.yageo-nexensos.com/tc or may be furnished upon request. This data sheet is subject to changes without prior notice.
