Microbond^® SMT650 Solder Paste for Fine Pitch Application In automotive Electronics

Features

• Prohibits Dendrite growth even in humid environments
• Compatibility with wide range of PCB coatings
• Excellent printing performance on various metallizations
• Good transfer efficiency even for apertures with small area ratios
• Excellent thermal mechanical strength with Innolot alloy
• Type 4 powder for fine pitch applications
• Clear residue
• Efficient wetting

Fore more information

Innotlot for high Reliability applications in automotive electronics

Features

• Standard operating temperature of 125C°, long term reliability is greatly improved compared to SAC
• Innolot significantly improves the creep strength of solder joints with ceramic components like resistors and capacitors
• Operating Temperatures up to 150C° are achievable

Pressure and Non-Pressure Sinter Materials

Why Sinter instead of Solder?

• 5x higher reliability
• Flux free which means no cleaning
• Higher Operating Temperatures
• Silicon Carbide applications operating temperature of 200C°
• No Reflow or bridging allow chips to be placed closer together

Engineering Services for SMT Applications

Features

• 2D, 3D CT X-Ray inspection with 3D reconstruction
• Local Technical support
• Full Analytical laboratory with SEM/EDS
• Defect and failure analysis with true RCCA
• Customer SMT Materials and process training
• Climate controlled clean room

Link to the Conshohocken application center page