- Exhibition February 4-6, 2020
- Conference February 4-6, 2020
- Booth# 1806
- San Diego CONVENTION CENTER, San Diego California
MEET OUR EXPERTS
PRODUCTS AT THE SHOW
Microbond® SMT650 Solder Paste for Fine Pitch Application In automotive Electronics
Features
- Prohibits Dendrite growth even in humid environments
- Compatibility with wide range of PCB coatings
- Excellent printing performance on various metallizations
- Good transfer efficiency even for apertures with small area ratios
- Excellent thermal mechanical strength with Innolot alloy
- Type 4 powder for fine pitch applications
- Clear residue
- Efficient wetting
Innotlot for high Reliability applications in automotive electronics
Features
- Standard operating temperature of 125C°, long term reliability is greatly improved compared to SAC
- Innolot significantly improves the creep strength of solder joints with ceramic components like resistors and capacitors
- Operating Temperatures up to 150C° are achievable

Pressure and Non-Pressure Sinter Materials
Why Sinter instead of Solder?
- 5x higher reliability
- Flux free which means no cleaning
- Higher Operating Temperatures
- Silicon Carbide applications operating temperature of 200C°
- No Reflow or bridging allow chips to be placed closer together
Engineering Services for SMT Applications
Features
- 2D, 3D CT X-Ray inspection with 3D reconstruction
- Local Technical support
- Full Analytical laboratory with SEM/EDS
- Defect and failure analysis with true RCCA
- Customer SMT Materials and process training
- Climate controlled clean room
