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2020-11-16 11:36:19

Condura®.prime - Next generation solutions with Active Metal Brazed Substrates

Condura.prime Substrate layout by courtesy of Fraunhofer IISB

Excellent mechanical properties and a high thermal conductivity of AMB-Si3N4 substrates make Condura®.prime an ideal material for high-reliable power electronics modules.

Silicon nitride (Si3N4) offers excellent mechanical properties (high bending strength, high fracture toughness) and a high thermal conductivity. The outstanding mechanical robustness of Si3N4 enables brazing with thick Cu layers offering additional thermal capacity order to dissipate load peaks. Thus baseplates become obsolete for certain applications. AMB-Si3N4 substrates combine best mechanical robustness with excellent heat dissipation properties featuring very high power densities. Optimal performance and reliability can be achieved by using silver sintering, Die Top System (DTS®) and Cu bonding technology. This setup also enables utilizing the full potential of wide bandgap (WBG) semiconductors (SiC, GaN).

For your specific needs, we identify the optimal material combination from our broad product portfolio: metal ceramic substrates with functional surfaces optimized for our sintering, soldering and bonding solutions.