Heraeus Electronics at PCIM Europe

Meet our experts at PCIM Europe 2019

Venue: Messe Nuremberg in Nuremberg, Germany
May 7th - 9th, 2019
Booth #9-533

Heraeus presents Microbond™ SMT650 Solder Paste at SMTconnect

Nuremburg, Germany- May 7th - 9th, 2019

For advanced solutions and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus. Heraeus innovative products, solutions and services enable customers to stay ahead in the market.

Heraeus Electronics at Power System Japan 2019

Meet our product and technical experts at Power System Japan 2019

Venue: Makuhari Messe in Chiba, Japan
April 17-19, 2019
Booth #6D-43

헤레우스(Heraeus), 금도금 처리한 은 본딩 와이어 세계 첫 개발…저비용 고성능 반도체 기술 기대

2019년 3월 20일, 수원: AgCoat Prime: 금∙은 합금 본딩 와이어 제품으로 우수한 성능 및 금 본딩 와이어 대비 뛰어난 가격 경쟁력 자랑