PC3000
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Screen Print
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10 min / 150 °C or 20 min / 120 °C (Standard Curing)
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Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications.
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PC3001
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Dispense
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10 min / 150 °C or 20 min / 120 °C (Standard Curing)
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Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications.
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PC3002
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Stencil Print
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10 min / 150 °C or 20 min / 120 °C (Standard Curing)
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Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications.
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PC3201
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Dispense
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1 min / 180 °C or 20 min / 120 °C (Fast Curing)
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DA on flex leadframes or foils for smartcards, RFID cards, etc.
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PC3601
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Dispense
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3 min / 150 °C or 80 min / 120 °C (Low Temperature Curing)
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Die & passive component attach on PCB for automotive applications (also components) camera modules.
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