In the passport and ID card market there is a permanent trend towards miniaturization and thickness reduction by increasing security requirements. Therefore, complexity in these applications increased. Additional security layers such as holograms or foils have to be installed into existing solutions. To achieve this, the card manufacturers need extremely thin lead frames.
With XOB10, Heraeus offers a lead frame with a thickness of only 35 µm compared to existing solutions with 60 µm and more. This allows to make the whole module thinner (200 µm and lower) and allow on this way to add additional security layers into existing solutions.
Heraeus XOB10 is produced out of stainless steel. The product is free available in the market and compatible with existing equipment which reduces changeover costs to the new generation of lead-frames.
As the sole company in the market, Heraeus also offers bonding wires and non-conductive adhesives for module packaging. In the own application center in Hanau, Heraeus can test technologies and tailor applications to specific customer needs.