Heraeus at ECTC 2017

Heraeus Electronics, your expert for materials and materials solutions for the electronics industry, will showcase some of its newest innovations at ECTC 2017. Matched materials help customers to develop solutions with higher power density and higher temperature. They also answer the demand for improved reliability and miniaturization.

Visit our booth and get information about Heraeus solutions.

May 30 - June 2, 2017

Walt Disney World Swan and Dolphin Resort
Lake Buena Vista, Florida

Booth 312, 314

Meet our experts at the booth and get in personal exchange.

Highlights at the show

A few of the featured solutions at ECTC include:

Visit our expert presentation

Our Sinter Materials experts Wolfgang Schmitt and Ly May Chew present their newest paper at the conference

Ly May Chew and Wolfgang Schmitt speak at PCIM  Europe
Ly May Chew and Wolfgang Schmitt

Friday, 02. June 2017, Session 33: Advanced Bonding and Soldering Technology
2:20 PM, Room: Southern Hemisphere III

Silver Sinter Paste for SiC Bonding with Improved Mechanical Properties

Authors: Wolfgang Schmitt, Ly May Chew

Thermo-mechanical tension might not be reduced easily by the interconnection materials, if the Young’s modulus of the material itself is high. A brittle die attach material might leads to crack and delamination due to the bending of the package caused by the CTE mismatch of the used materials. Consequently, a degradation of thermal conductivity and a reduced life time of the components occurred, particularly on the components which are operated at above 175°C. Silver sinter material with a reduced Young’s modulu as well as an adjusted CTE is desired to avoid crack and delamination.

This study shows the development of a silver sinter paste with improved mechanical properties. By adding non silver particles to the sinter paste, the Young’s modulus became independent of process parameters and became stable against further thermal exposure.

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