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Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology
Hanau/Garching, 24/03/04
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a JDA to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.
Speaker @ Techblick
Berlin, 2023/10/17
Franz Vollmann, Head of Heraeus Printed Electronics, delivered a presentation at the Techblick conference on the topic “Redefining Coatings in Electronic Packaging: Turnkey Digital Production Process for Selective Metallic Coating”. Access the presentation slides for detailed information.
Speaker @ IMAPS
San Diego, 2023/10/4
Download the speaker presentation titled ‘Unlocking the True Power of Additive Manufacturing for EMI Shielding,’ presented at the 56th International Symposium on Microelectronics in San Diego.
Heraeus opens innovation lab in Taiwan
Taipei, 2021/12/28
The Germany-based company plans to establish its new lab in Tai Yuen Hi-Tech Industrial Park in Zhubei City. The 180 square-meter, state-of-the-art facility will serve as a local application lab for the company and its local partners and is expected to open in the first half of 2022.
Heraeus offers new solutions for improved performance of 5G devices
Hanau, 2019/09/18
5G is currently on everyone's lips. However, many advantages of the new standard can only be exploited with improved devices. Heraeus offers solutions for the top four technical challenges.
Continuing A Strong Bond
Advancing the Next Challenge in Semiconductor Packaging
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