The Germany-based company plans to establish its new lab in Tai Yuen Hi-Tech Industrial Park in Zhubei City. The 180 square-meter, state-of-the-art facility will serve as a local application lab for the company and its local partners and is expected to open in the first half of 2022.
The new facility will house application and innovation teams of the Heraeus Global Business Unit Heraeus Electronics and corporate start-up Heraeus Printed Electronics and cater specifically to the regional semiconductor market. It will be the company’s fifth innovation center dedicated to electronics.
“The new innovation lab reflects Heraeus’ commitment to the region, while also representing a key milestone in our goal to becoming the number one technology partner for our customers,” said Chi Keung Lau, Executive Vice President and Global Head of Sales at Heraeus Electronics. “We are on-site, where our customers face unique market challenges. Being closer to local partners means quicker response times and faster development and support.”
The Taiwan innovation lab offers quick and comprehensive testing services and tailor-made solutions for local customers with a short lead time. The state-of-the-art equipment of the lab includes an industrial inkjet printing system to conduct multi-unit feasibility tests and proof of reproducibility for EMI shielding as well as quality management and testing equipment for solder pastes and wire bonding. Customers benefit from design support, materials analysis, troubleshooting, and the design of experiments conducted by Heraeus’ local industry experts.
“With the lab customers can bring parts over in a matter of hours or even minutes and immediately test,” adds Franz Vollmann, Head of Heraeus Printed Electronics. “This enables us to embed our material into customer development and offer a fast and easy response.”
Jointly testing and developing advanced packaging solutions helps customers improve the first-time success rate and shorten development cycles as today’s electronics devices need to deliver more functionality with more processing power and greater speed. Module complexity and the number of components in system-in-package are increasing, while devices must miniaturize. Customers face cost pressure and a need for higher integration support as well as customization and flexibility.
Attending Semicon Taiwan? Find our experts in materials pavilion at Booth No. I2300, 1F from December 28th till December 30th.