Heraeus Printed Electronics

• Complete solution from a single source: High Speed Inkjet Printing System, Particle-free Ag Ink and Curing System
• Superior shielding performance (-60 dB shielding with thin Ag coating)
• Selective Coating Capability
  • Customised print layout with targeted ink deposition to create selective printing; no masking or etching required
  • Reduces process complexity, time and cost
  • Offers package designers opportunity for various pattern layout without long cycle time and high costs
• Improved Efficiency (compared to PVD Sputtering)
  • 3 times lower capex and smaller footprint
  • Selective Printing enabling design flexibility & mask-free processing
  • Up to ​25%​ lower TCO

Why EMI Shielding?

Electromagnetic interference can disrupt electronic devices, equipment and systems. With the new generation of mobile phones especially for the new 5G technology, EMI shielding becomes more and more important. As frequencies increase, so does interference. Without proper shielding, our brand-new phones wouldn’t work.

In short: our EMI shielding solution is the innovative answer for technology that is going faster, higher and further everyday.

What are the advantages of Heraeus’ solution?

Prexonics^® combines three major components which are key for a successful EMI shielding process. A special silver ink formula, a manufacturing machine using an inkjet process and curing equipment. This is a one-of-a-kind combination making EMI shielding effective and efficient. Also, our inkjet process enables efficient selective printing, thereby giving our customers the opportunity for package design flexibility.

Given the current market trend of miniaturization as well as increasingly powerful electronics, this is the way to go.

Does that mean traditional shielding methods like metal housing or sputtering might become obsolete?

Yes, absolutely.

Today, metal housing has already become obsolete, since it doesn’t meet the requirements of miniaturization. Electronics gets smaller and smaller – metal housing doesn’t work on such a tiny scale.

As for sputtering: coating of a package according to design requirement involves higher complexity, process time and investment, resulting in an increasingly cost prohibitive solution, In contrast, our inkjet process offers customized selective printing in one step which reduces complexity, time and cost.

Heraeus opens innovation lab in Taiwan

Taipei, 2021/12/28

The Germany-based company plans to establish its new lab in Tai Yuen Hi-Tech Industrial Park in Zhubei City. The 180 square-meter, state-of-the-art facility will serve as a local application lab for the company and its local partners and is expected to open in the first half of 2022.

 Find here the full press release

Continuing A Strong Bond

Advancing the Next Challenge in Semiconductor Packaging

 Download our brochure and learn more about Heraeus Advanced Packaging Solutions