Heraeus Printed Electronics

Prexonics^® - Full System Solution for EMI Shielding in 5G Technology

Electromagnetic interference (EMI) is increasingly becoming a problem today – especially for mobile phones. To meet this challenge, Heraeus now offers with Prexonics^® an EMI full system solution consisting of silver ink and an inkjet printer for EMI shielding. This digital printing system is both cost effective and enables selective coating, offering full design flexibility to package designers.

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With the trend toward heterogenous integration, miniaturization and 5G, higher operating frequencies and higher semiconductor packaging density has led to the need for enhanced EMI shielding, both within the device and also against the electromagnetic noise from outside the device.

Therefore, compartment shielding at packaging level is required and classical shielding via metal housings is no longer possible at such a small scale.

Heraeus has developed a full system solution that optimizes EMI shielding while ensuring proper functioning of high-frequency onboard chips and their ultra-fast data transmission. This system consists of Heraeus special particle-free silver ink and a manufacturing process that uses inkjet printing to apply the shielding coating.

Heraeus as a full solution provider has the capability to match all process, product and equipment perfectly to each other. In our application center we offer design support, materials analysis, troubleshooting, and the design of experiments. This enables us to embed our material into customer development to achieve a maximum of system performance and reliability.

Your benefits at a glance with Prexonics^® - EMI Shielding Solution

Complete solution from a single source: High Speed Inkjet Printing System, Particle-free Ag Ink and Curing System
Superior shielding performance (-60 dB shielding with thin Ag coating)
Selective Coating Capability
- Customised print layout with targeted ink deposition to create selective printing; no masking or etching required
- Reduces process complexity, time and cost
- Offers package designers opportunity for various pattern layout without long cycle time and high costs
Improved Efficiency (compared to PVD Sputtering)
- 3 times lower capex and smaller footprint
- Selective Printing enabling design flexibility & mask-free processing
- Up to 25% lower TCO

Equipment tailored to your needs

Mass production equipment

Lab use equipment

Ink Starter Kit

Prexonics^® PES 2110

Equipment for mass production on populated wafer frame
Pre-treatment included
Automated loading and unloading

Download Prexonics® PES 2110 Flyer

Prexonics^® PES 1120

Equipment for lab use / technology validation
Multi-unit feasibility tests
Proof of reproducibility

Prexonics Ink Starter Kit

25ml Prexonics Silver D1 ink

More details about the starter kit and how to order it

Three questions to Franz Vollmann

Franz Vollmann - Head of Heraeus Printed Electronics — Franz Vollmann, Head of Heraeus Printed Electronics

Why EMI Shielding?

Electromagnetic interference can disrupt electronic devices, equipment and systems. With the new generation of mobile phones especially for the new 5G technology, EMI shielding becomes more and more important. As frequencies increase, so does interference. Without proper shielding, our brand-new phones wouldn’t work.

In short: our EMI shielding solution is the innovative answer for technology that is going faster, higher and further everyday.

What are the advantages of Heraeus’ solution?

Prexonics^® combines three major components which are key for a successful EMI shielding process. A special silver ink formula, a manufacturing machine using an inkjet process and curing equipment. This is a one-of-a-kind combination making EMI shielding effective and efficient. Also, our inkjet process enables efficient selective printing, thereby giving our customers the opportunity for package design flexibility.

Given the current market trend of miniaturization as well as increasingly powerful electronics, this is the way to go.

Does that mean traditional shielding methods like metal housing or sputtering might become obsolete?

Yes, absolutely.

Today, metal housing has already become obsolete, since it doesn’t meet the requirements of miniaturization. Electronics gets smaller and smaller – metal housing doesn’t work on such a tiny scale.

As for sputtering: coating of a package according to design requirement involves higher complexity, process time and investment, resulting in an increasingly cost prohibitive solution, In contrast, our inkjet process offers customized selective printing in one step which reduces complexity, time and cost.

Press, News and Downloads

Heraeus opens innovation lab in Taiwan

Taipei, 2021/12/28

The Germany-based company plans to establish its new lab in Tai Yuen Hi-Tech Industrial Park in Zhubei City. The 180 square-meter, state-of-the-art facility will serve as a local application lab for the company and its local partners and is expected to open in the first half of 2022.

Find here the full press release

Heraeus offers new solutions for improved performance of 5G devices

Hanau, 2019/09/18

5G is currently on everyone's lips. However, many advantages of the new standard can only be exploited with improved devices. Heraeus offers solutions for the top four technical challenges.

Find here the full press release.

Continuing A Strong Bond

Advancing the Next Challenge in Semiconductor Packaging

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Contents

Prexonics^® - Full System Solution for EMI Shielding in 5G Technology

Your benefits at a glance with Prexonics^® - EMI Shielding Solution