- Power Electronics Design & Manufacturing
- Motor Design & Manufacturing
- Cell Development & Battery Systems Engineering
- Testing, Powertrains, Charging Systems, Thermal Management, Circuit Protection, Wire & Cable, and More
What if, our materials made your module even more efficient?
Heraeus Electronics developed the Die Top System to enable copper wires or ribbons be placed on top of the die. The combination of the Die Top System with power Cu wire/ribbon can maximize the power density and power cycling reliability/lifetime of a power module.
Our new Condura®.ultra is a cost-effective Si3N4 Ag free AMB substrate. It is well positioned, being a sufficiently performing substrate, cost-effective, and highly reliable to meet the hybrid/electric vehicles drive train power module requirements.
Have we piqued your interest? You will find out more in the virtual presentation of Habib Mustain, Power Electronics Segment Manager at Heraeus Electronics.
Advanced Material Solutions For Automotive Power Module Applications
October 19 2022 / 2:45 pm EDT
For more information and registration, please click here