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Home
Innovation and Technology
Overview
Silver Sintering
Technical Challenges
Competitive Markets
Markets and Applications
Advanced Packaging
Power Electronics
Automotive Electronics
At a glance
ADAS and Safety Systems
Body Electronics and Infotainment Systems
Powertrain and Electromobility
Products and Solutions
At a Glance
Bonding Wires
At a Glance
Gold Bonding Wires
Gold-Coated Silver Wire
Silver Bonding Wires
Copper and Coated Copper Bonding Wires
Aluminum Fine Bonding Wires
Aluminum Power Bonding Wires and Ribbons
Copper Core Power Aluminum Wires
Copper Power Bonding Wires and Ribbons
Fine Bonding Ribbons
PowerCu-Soft Laser Ribbons (LRB)
Adhesives
At a glance
Conductive Adhesive
SMT Adhesives
Solder Materials
At a Glance
Solder Pastes for SMT Applications
Microbond® SMT660
Microbond® SMT650
Microbond® SMT645
Microbond® SMT701
Microbond® SMT712
Microbond® SMT911
Solder Pastes for Die Attach
Microbond® DA5118
Solder Pastes for Power Electronics
Microbond® PE830
Solder Pastes for Advanced Packaging
Welco AP5112
Welco AP519
Welco AP520 (NEW)
AP500X Flux (NEW)
Solder Paste for mini-LED
Overview
Welco LED101 (NEW)
Welco LED120
Welco LED131
Welco AP519
Solder Wires
Solder Powders
Innolot® / High Reliability Alloys
Sinter Materials
At a Glance
mAgic DA295A
mAgic PE338
PE401 (NEW)
Thick Film Materials
At a Glance
Hybrid Circuit Pastes
Thick Film Heater Materials
Passive Component Pastes
Pastes for Fuel Level Sensors
Sensor Pastes
Nitrogen Fireable Pastes
Precious Metal Powders
Technical Datasheets
Metal Ceramic Substrates
Condura®
At a glance
Condura®.classic
Condura®.extra
Condura®.prime
Condura®.ultra
Condura®+
Material Systems
Overview
Die Top System
Condura®+ with pre-applied solder
E-Shop
Engineering Services
Overview
Hanau
Shanghai
West Conshohocken
Singapore
Company
About Heraeus Electronics
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Home
Innovation and Technology
Overview
Silver Sintering
Technical Challenges
Competitive Markets
Markets and Applications
Advanced Packaging
Power Electronics
Automotive Electronics
At a glance
ADAS and Safety Systems
Body Electronics and Infotainment Systems
Powertrain and Electromobility
Products and Solutions
At a Glance
Bonding Wires
At a Glance
Gold Bonding Wires
Gold-Coated Silver Wire
Silver Bonding Wires
Copper and Coated Copper Bonding Wires
Aluminum Fine Bonding Wires
Aluminum Power Bonding Wires and Ribbons
Copper Core Power Aluminum Wires
Copper Power Bonding Wires and Ribbons
Fine Bonding Ribbons
PowerCu-Soft Laser Ribbons (LRB)
Adhesives
At a glance
Conductive Adhesive
SMT Adhesives
Solder Materials
At a Glance
Solder Pastes for SMT Applications
Microbond® SMT660
Microbond® SMT650
Microbond® SMT645
Microbond® SMT701
Microbond® SMT712
Microbond® SMT911
Solder Pastes for Die Attach
Microbond® DA5118
Solder Pastes for Power Electronics
Microbond® PE830
Solder Pastes for Advanced Packaging
Welco AP5112
Welco AP519
Welco AP520 (NEW)
AP500X Flux (NEW)
Solder Paste for mini-LED
Overview
Welco LED101 (NEW)
Welco LED120
Welco LED131
Welco AP519
Solder Wires
Solder Powders
Innolot® / High Reliability Alloys
Sinter Materials
At a Glance
mAgic DA295A
mAgic PE338
PE401 (NEW)
Thick Film Materials
At a Glance
Hybrid Circuit Pastes
Thick Film Heater Materials
Passive Component Pastes
Pastes for Fuel Level Sensors
Sensor Pastes
Nitrogen Fireable Pastes
Precious Metal Powders
Technical Datasheets
Metal Ceramic Substrates
Condura®
At a glance
Condura®.classic
Condura®.extra
Condura®.prime
Condura®.ultra
Condura®+
Material Systems
Overview
Die Top System
Condura®+ with pre-applied solder
E-Shop
Engineering Services
Overview
Hanau
Shanghai
West Conshohocken
Singapore
Company
About Heraeus Electronics
Trade Shows and Events
Press and News
Quality Systems
Trademarks
Contact
Contact Form
Logistic Returns
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