Packaging Options

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Note

This page provides an overview of all packaging types used at Heraeus Nexensos. Specific packaging options are listed on the product data sheet. Not all options are available for all products.

Slide Blister

Hinge Box

Plastic Box

VCI Plastic/Plastic Bag

Blister Reel

Wafer Frame

Best before date: The product can be processed for 6 months after the packaging date (production date).

Wafer size: 6 inches (150 mm)

1 substrate per wafer

From June 2020 up to 4 substrates per wafer