2019/04/25 - New solder paste from Heraeus enables further reliable miniaturization in automotive electronics

The right chemistry for greater reliability.

Heraeus Electronics has developed its new solder paste Microbond SMT650, which guarantees consistently high surface resistance.

Heraeus Electronics at PCIM Europe

Meet our experts at PCIM Europe 2019

Venue: Messe Nuremberg in Nuremberg, Germany
May 7th - 9th, 2019
Booth #9-533

Heraeus presents Microbond™ SMT650 Solder Paste at SMTconnect

Nuremburg, Germany- May 7th - 9th, 2019

For advanced solutions and next-generation materials innovations, the microelectronics and semiconductor industries turn to Heraeus. Heraeus innovative products, solutions and services enable customers to stay ahead in the market.

E-mobility boom in Japan requires best power electronics solutions from Heraeus with highest reliability and performance

15.04.2019: New sintering solutions from Heraeus perfectly match the growing demand of high-performance power electronics in Japan. Innovative materials revolutionize chip contacting, yet they increase power density and lengthen the service life of components to meet Japan’s top-quality standards. With its Die Top System, Heraeus now offers an efficient and flexible solution.

Heraeus presents world’s first gold-coated silver bonding wire for semiconductor technology to ensure high performance at significant lower cost

20.03.2019: In the highly competitive memory market, no adequate substitute for gold bonding wire has been developed – until now. With AgCoat Prime, Heraeus Electronics introduces gold-coated silver bonding wire that provides the bondability and reliability of gold wire, enabling significant net cost savings.