16.03.2021: Heraeus Electronics will present two state-of-the-art solder paste products at the SEMICON China on March 17-19. Both products offer solutions in response to the increasing demand from the advanced packaging industry in terms of miniaturization, thermal budget management and cost reduction.

01.03.2020: New Heraeus SD1020 insulative technology for circuits and heaters on stainless steel significantly improves performance and production yields

25.02.2020

The three technology companies Heraeus, perfecdos and Infotech automation have jointly developed a solution that offers their customers ideally matched components and materials for jetting sintering pastes.

TAIPEI, 23.09.2020: Heraeus AgCoat Prime Gold-Coated Silver Bonding Wire combines the advantages of gold and silver offering an alternative to gold bonding wire for the packaging industry.

07.07.2020: Heraeus Electronics today announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.