Heraeus @ Semicon Taiwan

Continuing a Strong Bond - With Our Advanced Packaging Solutions For The Semiconductor Industry

Stop by at our booth to learn more:​
23 September – 25 September 2020​, Taipei Nangang Exhibition Center

Materials for the next generation of power electronics: Heraeus presents new bonding ribbon

07.07.2020: Heraeus Electronics today announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.

your123 – stock.adobe.com
Beyond 2020: Heraeus offers solutions for semiconductors in AI, IoT and Big Data applications

27.06.2020: Artificial Intelligence, the Internet of Things and Big Data will drive the semiconductor market. Heraeus develops innovative solutions for technologies in a smart and digital future.

Heraeus launches next generation Copper Core Aluminum Wire for power applications

06.05.2020: Heraeus Electronics today announced the launch of a next generation wire for power applications. The product named CucorAl Plus renews the existing product CucorAl offering superior electrical and mechanical properties combined with a better processability.

Materials Solutions for the Electronics Packaging and Component Industry