Same performance, lower costs: Heraeus exhibits Gold-Coated Silver Bonding Wire for memory devices at SEMICON Taiwan

TAIPEI, 23.09.2020: Heraeus AgCoat Prime Gold-Coated Silver Bonding Wire combines the advantages of gold and silver offering an alternative to gold bonding wire for the packaging industry.

Materials for the next generation of power electronics: Heraeus presents new bonding ribbon

07.07.2020: Heraeus Electronics today announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.

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Beyond 2020: Heraeus offers solutions for semiconductors in AI, IoT and Big Data applications

27.06.2020: Artificial Intelligence, the Internet of Things and Big Data will drive the semiconductor market. Heraeus develops innovative solutions for technologies in a smart and digital future.

Heraeus launches next generation Copper Core Aluminum Wire for power applications

06.05.2020: Heraeus Electronics today announced the launch of a next generation wire for power applications. The product named CucorAl Plus renews the existing product CucorAl offering superior electrical and mechanical properties combined with a better processability.

Materials Solutions for the Electronics Packaging and Component Industry