Visit our experts during Semicon West
Venue: Bay Area
July 29 – 11, 2019
Meet our product and technical experts at PCIM Asia 2019
Venue: Shanghai World Expo Exhibition & Convention Center, China
June 26 – 28, 2019
Booth #B05 (H2-3)
The right chemistry for greater reliability.
Heraeus Electronics has developed its new solder paste Microbond SMT650, which guarantees consistently high surface resistance.
15.04.2019: New sintering solutions from Heraeus perfectly match the growing demand of high-performance power electronics in Japan. Innovative materials revolutionize chip contacting, yet they increase power density and lengthen the service life of components to meet Japan’s top-quality standards. With its Die Top System, Heraeus now offers an efficient and flexible solution.
20.03.2019: In the highly competitive memory market, no adequate substitute for gold bonding wire has been developed – until now. With AgCoat Prime, Heraeus Electronics introduces gold-coated silver bonding wire that provides the bondability and reliability of gold wire, enabling significant net cost savings.