06.05.2020: Heraeus Electronics today announced the launch of a next generation wire for power applications. The product named CucorAl Plus renews the existing product CucorAl offering superior electrical and mechanical properties combined with a better processability.

26.03.2020: Heraeus Electronics has received the 16949 certification of the International Automotive Task Force (IATF) for its site in West Conshohocken, Pennsylvania.

12.03.2020: Heraeus Electronics today announced the launch of a new sinter paste. The new paste with the product name mAgic DA295A is a low temperature, non-pressure sintering solution and part of Heraeus’ mAgic sinter pastes product series.

26.11.2019: Heraeus Electronics today announced the launch of a new ultra-thin lead frame with the product name XOB10. The product is used for Radio Frequency Identification (RFID) systems.