TAIPEI, 23.09.2020: Heraeus AgCoat Prime Gold-Coated Silver Bonding Wire combines the advantages of gold and silver offering an alternative to gold bonding wire for the packaging industry.

07.07.2020: Heraeus Electronics today announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.

27.06.2020: Artificial Intelligence, the Internet of Things and Big Data will drive the semiconductor market. Heraeus develops innovative solutions for technologies in a smart and digital future.

06.05.2020: Heraeus Electronics today announced the launch of a next generation wire for power applications. The product named CucorAl Plus renews the existing product CucorAl offering superior electrical and mechanical properties combined with a better processability.