Maximized Reliability with Perfectly Matched Materials

Visit Heraeus on Nepcon Japan 2020 and learn more about our solutions

January 15th – 17th, 2020
Tokyo Big Sight, Japan
Booth #W11-41

Sinter Seminar by Heraeus Electronics Academy

Attend our Sinter Seminar!

19th – 20th March 2020
Heraeus in Hanau, Germany

Maximized Reliability with Heraeus SMT and Sinter Solutions

Visit Heraeus on IPC APEX 2020 and learn more about our solutions

February 4th - 6th, 2020
San Diego Convention Center California
Booth #1806

Heraeus presents new ultra-thin lead frame to increase security for ID cards

26.11.2019: Heraeus Electronics today announced the launch of a new ultra-thin lead frame with the product name XOB10. The product is used for Radio Frequency Identification (RFID) systems.

Heraeus offers new solutions for improved performance of 5G devices

18/09/2019 - Hanau, Germany: 5G is currently on everyone's lips. However, many advantages of the new standard can only be exploited with improved devices. Heraeus offers solutions for the top four technical challenges.

Materials Solutions for the Electronics Packaging and Component Industry