Heraeus launches next generation Copper Core Aluminum Wire for power applications

06.05.2020: Heraeus Electronics today announced the launch of a next generation wire for power applications. The product named CucorAl Plus renews the existing product CucorAl offering superior electrical and mechanical properties combined with a better processability.

Heraeus in Pennsylvania receives IATF certification for quality

26.03.2020: Heraeus Electronics has received the 16949 certification of the International Automotive Task Force (IATF) for its site in West Conshohocken, Pennsylvania.

Heraeus launches new sinter paste with superior thermal conductivity

12.03.2020: Heraeus Electronics today announced the launch of a new sinter paste. The new paste with the product name mAgic DA295A is a low temperature, non-pressure sintering solution and part of Heraeus’ mAgic sinter pastes product series.

Heraeus presents new ultra-thin lead frame to increase security for ID cards

26.11.2019: Heraeus Electronics today announced the launch of a new ultra-thin lead frame with the product name XOB10. The product is used for Radio Frequency Identification (RFID) systems.

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