Heraeus to introduce new solutions for advanced packaging and miniLED die attach applications at SEMICON China

16.03.2021: Heraeus Electronics will present two state-of-the-art solder paste products at the SEMICON China on March 17-19. Both products offer solutions in response to the increasing demand from the advanced packaging industry in terms of miniaturization, thermal budget management and cost reduction.

Heraeus Electronics launches revolutionary high-performance dielectric paste technology for stainless steel

01.03.2020: New Heraeus SD1020 insulative technology for circuits and heaters on stainless steel significantly improves performance and production yields

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Heraeus, perfecdos and Infotech optimize jetting process of sintering pastes

25.02.2020

The three technology companies Heraeus, perfecdos and Infotech automation have jointly developed a solution that offers their customers ideally matched components and materials for jetting sintering pastes.

Same performance, lower costs: Heraeus exhibits Gold-Coated Silver Bonding Wire for memory devices at SEMICON Taiwan

TAIPEI, 23.09.2020: Heraeus AgCoat Prime Gold-Coated Silver Bonding Wire combines the advantages of gold and silver offering an alternative to gold bonding wire for the packaging industry.

Materials for the next generation of power electronics: Heraeus presents new bonding ribbon

07.07.2020: Heraeus Electronics today announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.

Materials Solutions for the Electronics Packaging and Component Industry