Heraeus Electronics at SEMICON Taiwan 2019

Showcasing Advanced Materials for Your Packaging Solutions

The Battery Show 2019

Meet our experts at the Battery Show on September 10-12, 2019 in Novi, MI.

Visit us at Booth #1636 to learn more about our unique packaging solutions for the power electronics market.

The next step: Sintering is the key to future power electronics

In modern power electronics applications, requirements are becoming more demanding. Soldered connections are reaching their limits. Sintering is increasingly becoming indispensable. Dennis Ang, sintering expert at Heraeus, knows what challenges the new technology introduces and what users must consider when making the transition.

2019/04/25 - New solder paste from Heraeus enables further reliable miniaturization in automotive electronics

The right chemistry for greater reliability.

Heraeus Electronics has developed its new solder paste Microbond SMT650, which guarantees consistently high surface resistance.

E-mobility boom in Japan requires best power electronics solutions from Heraeus with highest reliability and performance

15.04.2019: New sintering solutions from Heraeus perfectly match the growing demand of high-performance power electronics in Japan. Innovative materials revolutionize chip contacting, yet they increase power density and lengthen the service life of components to meet Japan’s top-quality standards. With its Die Top System, Heraeus now offers an efficient and flexible solution.