mAgic® Sinter Pastes for high performance applications

Higher power densities come along with a higher operation temperature. At the same time, devices must last longer. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times.

mAgic® Sinter Pastes
Pressure sinter paste is also available in cartridge now

Major trends in electronic applications involve operation temperatures above 150 °C, increased power density and longer lifetime. This requires a high melting temperature and fatigue resistance, improved thermal conductivity and reduced electrical resistivity of the connecting material.

Silver based sintering technology is suited for high operation temperatures due to its pure Ag die attach layer. They also provide excellent thermal conductivity and at the same time a longer lifetime compared to solder.

The Heraeus mAgic® series sinter material is suitable for power applications on DCB (pressure sintering) as well as for lead frame packages (non-pressure sintering).

The special series for pressure sintering mAgic® PE338 (formerly ASP338) shows an increased lifetime up to 10 times more compared to conventional solder in power cycling. As well, it requires lower process pressure compared to other sintering materials.

For non-pressure sintering applications, sinter mAgic® DA295 (formerly ASP295) series is a lead-free substitute for high melting point solders. The products are available for the usage in semiconductor applications. These come as print or dispense version and offer high thermal conductivity for lead frame and LED packages.

Use the Heraeus experience to find the best solution for your die attach application.

Key benefits of mAgic sinter paste:

  • Up to 10 times higher lifetime compared to solder paste
  • Applicable from extremely low to high temperature range (-55 to 250°C) due to the solid silver layer
  • Pure Ag interconnect for operation temperatures up to 250°C
  • Enables increasing of power density (system cost reduction) at a total costs level comparable to solder process
  • Typical thermal conductivity of 150 W/mK and above
  • Zero-halogen formulation
  • Less process steps due to no flux cleaning, no splattering
  • Designed for use in automatic processing with industrial equipment
  • Wide process window:
    - stencil life time >8h
    - both pressure and non pressure sintering available
    - variable process temperatures of 200 – 250°C

Non-Pressure Sinter Paste

Product Material
Workable Surfaces Sintering Temperature Sintering Atmosphere Comment
 mAgic® DA295 A Dispensing Au, Ag >200 °C Air, N2 Needle diameter > 0.2mm
Positive results on die size <4mm2
Optimized for ENIG PCB surfaces

Pressure Sinter Paste Series

Product Material
Die Size Sintering Temp., Pressure Description
 mAgic® PE338 Printing Au, Ag, Cu Up to 15x15mm >230°C, in Air or N2
>10MPa or 30MPa (Cu)
Suitable for SiC, GaN die attach
on ceramic substrate
 mAgic® PE338 F1510 Printing Au, Ag, Cu Up to 15x15mm >230°C, in Air or N2
>10MPa or 30MPa (Cu)
Suitable for SiC, GaN die attach
on ceramic substrate

Optimized for application with SiC power