Major trends in electronic applications involve operation temperatures above 150 °C, increased power density and longer lifetime. This requires a high melting temperature and fatigue resistance, improved thermal conductivity and reduced electrical resistivity of the connecting material.
Silver based sintering technology is suited for high operation temperatures due to its pure Ag die attach layer. They also provide excellent thermal conductivity and at the same time a longer lifetime compared to solder.
The Heraeus mAgic® series sinter material is suitable for power applications on DCB (pressure sintering) as well as for lead frame packages (non-pressure sintering).
The special series for pressure sintering mAgic® PE338 (formerly ASP338) shows an increased lifetime up to 10 times more compared to conventional solder in power cycling. As well, it requires lower process pressure compared to other sintering materials.
For non-pressure sintering applications, sinter mAgic® DA295 (formerly ASP295) series is a lead-free substitute for high melting point solders. The products are available for the usage in semiconductor applications. These come as print or dispense version and offer high thermal conductivity for lead frame and LED packages.
Use the Heraeus experience to find the best solution for your die attach application.