With Heraeus Advanced packaging solutions, miniaturization of interconnections in complex devices can be realized. Electronic devices are getting continually smaller and more chip functions are integrated into smaller packages. For the solder process pastes with very fine powders are needed. Heraeus Advanced packaging pastes solutions use Heraeus proprietary Welco technology which can realize powder sizes from type 5 to type 7. Because of the superior quality and sphericity of Welco technology, our customers can use this material in fine pitch applications down to 80 um.
Visit our experts during Semicon West from July 9th to 11th at booth 5557 for more information.