Semicon West

Heraeus Electronics will be returning to the bay area in 2019 for Semicon West, bringing its latest innovations for Advanced Packaging (System in Package) applications.

With Heraeus Advanced packaging solutions, miniaturization of interconnections in complex devices can be realized. Electronic devices are getting continually smaller and more chip functions are integrated into smaller packages. For the solder process pastes with very fine powders are needed. Heraeus Advanced packaging pastes solutions use Heraeus proprietary Welco technology which can realize powder sizes from type 5 to type 7. Because of the superior quality and sphericity of Welco technology, our customers can use this material in fine pitch applications down to 80 um.

Visit our experts during Semicon West from July 9th to 11th at booth 5557 for more information.

Product Highlights at Semicon West for Advanced Packaging Pastes Applications

Video Highlights of our Advanced Packaging Pastes Applications

Interested to know more about our products? Choose a schedule below to meet us at Semicon West

Trade show dates:

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