SMT Adhesives with high green strength for high speed production processes

During the fast placement process in the Surface-Mount Technology (SMT), an adhesive with high green strength is used to avoid the displacement of components until they are soldered. Heraeus offers a SMT adhesive with excellent properties during the process as well as after soldering.

SMT Adhesives

SMT adhesives are used in surface-mount assemblies on PCB to fix components to the board during wave soldering or double sided reflow. The adhesive is used to bond the Surface-Mount Device (SMD) to the PCB, in order to avoid displacement of components during high speed processes. The wet adhesive must provide sufficient “green” strength to hold the SMD in place during the complete soldering process. As well, the adhesive must not affect the function of the electronics circuit.

SMT adhesives are also used for BGA corner bonding to increase mechanical strength and reliability to BGAs and similar Chip-Scale Packages (CSPs): the material provides additional shock and bending resistance to the assembly.

Heraeus SMT adhesives are one-component thermo-setting solvent-free adhesives. They guarantee excellent adhesion with standard as well as with difficult-to-glue components. Best dispensing properties lead to maximum through-put and low cost of ownership. They are suitable for all common application methods such as printing, dispensing, pin transfer and jetting.

Our specialists with many years of experience support you with their technical expertise and application know-how in the selection of the best adhesive for your application. We can test our products directly in our application and technology centre. Save time and money with Heraeus as a qualified partner and accelerate your process.

Your benefits at a glance:

  • High green strength for perfect fixation in high speed production processes during curing as well as during soldering process steps
  • Excellent adhesion with standard as well as with difficult-to-glue components
  • No negative effect to the function of the electronic circuit
  • One component thermo-setting solvent-free adhesive
  • High Surface Insulation Resistance (SIR)
  • Lead-free soldering
  • Halogen-free series available

Your advantage in working with Heraeus:

  • Pretested solutions due to our in-house application centre

Our SMT adhesive are used for board assembly in the following industries:

Automotive:

  • Engine management (Engine Control Unit ECU)
  • Transmission controllers
  • Braking (ABS)
  • Steering and stability systems (ABS, ESP, EPS / EPAS)

Consumer electronics & computing:

  • Smartphones and tablets
  • Imaging devices
  • Servers and systems

Furthermore it can be used in other applications in the LED and communications industry.

Product Name Application Method Curing Temperature * Color Application
 PD955PY Printing 3 min / 125 °C (Standard Curing) Yellow Attachment of SMT components onto PCBs and for use on bare substrates with high green strength
 PD955PRM Printing 3 min / 125 °C (Standard Curing) Pink Attachment of SMT components onto PCBs and for use on bare substrates with high green strength
 PD955M Dispensing 3 min / 125 °C (Standard Curing) Red Attachment of SMT components onto PCBs and for use on bare substrates with high adhesion on difficult to glue components
 PD205A-Jet Jetting 3 min / 125 °C (Standard Curing) Red Attachment of SMT components onto PCBs and for use on bare substrates for jetting applications