Power electronic semiconductor devices are facing significant technical challenges. With the ever-growing power density, they need to be able to perform reliably on much higher temperatures than in the past, up to 200°C. In addition, higher active and passive temperature cycle capability is required. Automotive applications lifetimes with their minimum of 15 years are still relatively short compared to wind power applications (25) and traction applications, which have to last 30-40 years and longer.
In order to achieve this extreme reliability and robustness, packaging and joining technology needs to advance massively: With the attachment of copper bonding wire to the die the problem could be solved, as copper ensures a uniform thermal distribution, can endure much higher temperatures than aluminum and is by far more reliable. However, this configuration is typically difficult to process, as the die will break due to the usage of hard copper material.
With the new Heraeus Die Top System these problems can be solved. A thin copper layer in-between chip and copper wire protects the die during the wire bonding process. It enables simple processing without paste printing and complicated die fixation processes, increasing the performance and the yield. The Die Top System is a single component, which consists of a copper foil with:
- Functional surfaces for bonding on the upper side
- Pre-applied mAgic® sinter paste and Die Fixation System on the under side
It is matched to Heraeus PowerCu Soft and CucorAl bonding wire (copper and Al-coated copper thick wire).
Heraeus has the capability to match all these materials in the Die Top System perfectly to each other. In our application center we test our adaptions directly and optimize all interfaces between the materials in order to achieve a maximum of system performance and reliability.
Save time and money with Heraeus as a qualified partner and accelerate your development process.