Die Top System (DTS®) - Get the most out of your power module

Due to the continuous rise in power density, coupled with higher operating temperatures and the demand for improved reliability, current packaging materials are facing their limits. The Heraeus Die Top System (DTS®) pushes those limits by combining copper wire with sinter technology, whilst offering superior flexibility. It significantly improves the electrical and thermal conductivity as well as the reliability of the die connection and optimizes the whole module performance. Additionally, it simplifies industrialization, maximizes the profitability and helps to bring the next generation of power modules faster to market.

You want to boost lifetime and power density in your power modules? Free yourself from the technical limitations that come with today’s standard die interconnection based on solder paste and aluminum wire bonding.

With the new Heraeus Die Top System – short DTS® – you can achieve a more than 50 times longer lifetime and an over 50 % higher die current capability. DTS furthermore opens the road for junction temperatures of more than 200° Celsius. Thereby, DTS will positively affect your cost per ampere, by significantly decreasing power derating or by reducing the chip size at same ampere.

The Heraeus Die Top System is a material system consisting of:

  • Copper foil with functional surfaces
  • Pre-applied mAgic sinter paste
  • Optional adhesive for DTS® fixation prior to sintering
  • Matched copper bonding wires

Heraeus has the capability to match all these materials in the Die Top System perfectly to each other. In our application center, we test our adaptions directly and optimize all interfaces between the materials in order to achieve a maximum of system performance and reliability.

Save time and money with Heraeus as a qualified partner and accelerate your development process.

Your benefits with Heraeus Die Top System:

  • Best performance:
    • Die current capability increases >50 % vs. Aluminum wire
    • > 50x longer lifetime vs. solder die attach and Al-wire
    • Reduced peak temperature across the die
    • Enables higher junction temperatures of more than 200 °C
    • Superior robustness vs. other solutions (e.g. clips)
  • Simplified industrialization:
    • Use of wire bonding, the most common interconnect technology in Electronics
    • One sinter step for bottom and top die attach
    • Pre-tested and perfectly matched material system
    • Same equipment covers all layout variances from pilot to serial production
  • Highest flexibility:
    • DTS is adaptable to any die
    • Tailored to customer specific designs
  • Maximized profitability:
    • Maximized chip power density
    • Downsizing of cooling system
    • Minimized total cost of ownership for advanced die connections

Your advantages in working with Heraeus:

  • Heraeus is the sinter expert in the market
  • Exactly the right solution for your application, adapted to your needs
  • Faster implementation through Heraeus engineering services
  • Pre-tested and perfectly matched material set
  • Capability to test all adaptations in our in-house application center
  • High innovation capabilities

The Die Top System enables wide band gap semiconductors and future high temperature applications:

  • Automotive - Power train H(EV)
  • Wind
  • Traction
  • Power conversion
  • Marine
  • Heavy crane
  • Other, e.g. agriculture, mining

The single component Die Top System is matched to a Heraeus PowerCu Soft wire (copper thick wire) or CucorAl wire (Al-coated copper thick wire).

Bond substrate:

Core material: Cu, Cu-Alloys
Functional surfaces (optional): Ag, Au, Pd
Thickness: 30 - 500µm
Thermal conductivity: 180 – 390 W/mK
Tensile strength (Rm): 200 - 650 N/mm2
Hardness (HV): 40 - 240

Pre applied Ag-sinter layer:

Recommended sinter pressure: 10-30 MPa
Recommended sinter temperature: 230 - 280°C
Thermal conductivity: >150 W/mK
Cleaning: Not needed

Process parameters depend on customer design. We can support you to find the optimal process for your application.

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